MEMS Actuation System

ABSTRACT

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

RELATED CASE(S)

This application claims the benefit of U.S. Provisional Application No.62/736,940 filed on 26 Sep. 2018; the contents of which are incorporatedherein by reference.

TECHNICAL FIELD

This disclosure relates to actuators in general and, more particularly,to miniaturized MEMS actuators configured for use within camerapackages.

BACKGROUND

As is known in the art, actuators may be used to convert electronicsignals into mechanical motion. In many applications such as e.g.,portable devices, imaging-related devices, telecommunicationscomponents, and medical instruments, it may be beneficial for miniatureactuators to fit within the small size, low power, and cost constraintsof these application.

Micro-electrical-mechanical system (MEMS) technology is the technologythat in its most general form may be defined as miniaturized mechanicaland electro-mechanical elements that are made using the techniques ofmicrofabrication. The critical dimensions of MEMS devices may vary fromwell below one micron to several millimeters. In general, MEMS actuatorsare more compact than conventional actuators, and they consume lesspower.

SUMMARY OF DISCLOSURE

In one implementation, a multi-axis MEMS assembly includes: amicro-electrical-mechanical system (MEMS) actuator configured to providelinear three-axis movement, the micro-electrical-mechanical system(MEMS) actuator including: an in-plane MEMS actuator, and anout-of-plane MEMS actuator; and an optoelectronic device coupled to themicro-electrical-mechanical system (MEMS) actuator; wherein the in-planeMEMS actuator includes an electromagnetic actuator portion.

One or more of the following features may be included. Theoptoelectronic device may be coupled to one or more of: the in-planeMEMS actuator; and the out-of-plane MEMS actuator. The in-plane MEMSactuator may be an image stabilization actuator. The in-plane MEMSactuator may be configured to provide linear X-axis movement and linearY-axis movement. The in-plane MEMS actuator may further be configured toprovide rotational Z-axis movement. The out-of-plane MEMS actuator maybe an autofocus actuator. The out-of-plane MEMS actuator may beconfigured to provide linear Z-axis movement. The electromagneticactuator portion may include: at least one magnetic assembly. The atleast one magnetic assembly may be configured to enable in-planedisplacement of the optoelectronic device. The at least one magneticassembly may include a plurality of magnetic assemblies. The pluralityof magnetic assemblies may be configured to enable X-axis and/or Y-axisdisplacement of the optoelectronic device.

In another implementation, a multi-axis MEMS assembly includes: amicro-electrical-mechanical system (MEMS) actuator configured to providelinear three-axis movement, the micro-electrical-mechanical system(MEMS) actuator including: an in-plane MEMS actuator including anelectromagnetic actuator portion, and an out-of-plane MEMS actuator; andan optoelectronic device coupled to the micro-electrical-mechanicalsystem (MEMS) actuator.

One or more of the following features may be included. Theelectromagnetic actuator portion may include: at least one magneticassembly configured to enable in-plane displacement of theoptoelectronic device. The at least one magnetic assembly may include aplurality of magnetic assemblies. The plurality of magnetic assembliesmay be configured to enable X-axis and/or Y-axis displacement of theoptoelectronic device.

In another implementation, a multi-axis MEMS assembly includes: amicro-electrical-mechanical system (MEMS) actuator configured to providelinear multi-axis movement, the micro-electrical-mechanical system(MEMS) actuator including: an in-plane MEMS actuator including anelectromagnetic actuator portion; and an optoelectronic device coupledto the micro-electrical-mechanical system (MEMS) actuator.

One or more of the following features may be included. Theelectromagnetic actuator portion may include at least one magneticassembly configured to enable in-plane displacement of theoptoelectronic device. The at least one magnetic assembly may include aplurality of magnetic assemblies. The plurality of magnetic assembliesmay be configured to enable X-axis and/or Y-axis displacement of theoptoelectronic device. The plurality of magnetic assemblies may furtherbe configured to provide rotational Z-axis movement.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features andadvantages will become apparent from the description, the drawings, andthe claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a MEMS package in accordance withvarious embodiments of the present disclosure;

FIG. 2A is a diagrammatic view of an in-plane MEMS actuator with theoptoelectronic device in accordance with various embodiments of thepresent disclosure;

FIG. 2B is a perspective view of an in-plane MEMS actuator with theoptoelectronic device in accordance with various embodiments of thepresent disclosure;

FIG. 3 is a diagrammatic view of an in-plane MEMS actuator in accordancewith various embodiments of the present disclosure;

FIG. 4 is a diagrammatic view of a comb drive sector in accordance withvarious embodiments of the present disclosure;

FIG. 5 is a diagrammatic view of a comb pair in accordance with variousembodiments of the present disclosure;

FIG. 6 is a diagrammatic view of fingers of the comb pair of FIG. 5 inaccordance with various embodiments of the present disclosure;

FIGS. 7A-7C are diagrammatic views of an out-of-plane actuator inaccordance with various embodiments of the present disclosure;

FIG. 8 is a diagrammatic view of a MEMS package in accordance withvarious embodiments of the present disclosure;

FIGS. 9-10 are diagrammatic views of an electromagnetic MEMS actuator inaccordance with various embodiments of the present disclosure;

FIG. 11 is a detail view of a motion stage of the electromagnetic MEMSactuator of FIGS. 9-10 in accordance with various embodiments of thepresent disclosure;

FIG. 12 is a detail view of an electromagnetic actuator portion of theelectromagnetic MEMS actuator of FIGS. 9-10 in accordance with variousembodiments of the present disclosure; and

FIG. 13 is a cross-sectional view of the electromagnetic MEMS actuatorof FIGS. 9-10 in accordance with various embodiments of the presentdisclosure.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS System Overview:

Referring to FIG. 1, there is shown MEMS package 10, in accordance withvarious aspects of this disclosure. In this example, MEMS package 10 isshown to include printed circuit board 12, multi-axis MEMS assembly 14,driver circuits 16, electronic components 18, flexible circuit 20, andelectrical connector 22. Multi-axis MEMS assembly 14 may includemicro-electrical-mechanical system (MEMS) actuator 24 (configured toprovide linear three-axis movement) and optoelectronic device 26 coupledto micro-electrical-mechanical system (MEMS) actuator 24.

As will be discussed below in greater detail, examples ofmicro-electrical-mechanical system (MEMS) actuator 24 may include butare not limited to an in-plane MEMS actuator, an out-of-plane MEMSactuator, and a combination in-plane/out-of-plane MEMS actuator. Forexample and if micro-electrical-mechanical system (MEMS) actuator 24 isan in-plane MEMS actuator, the in-plane MEMS actuator may include anelectrostatic comb drive actuation system (as will be discussed below ingreater detail). Additionally, if micro-electrical-mechanical system(MEMS) actuator 24 is an out-of-plane MEMS actuator, the out-of-planeMEMS actuator may include a piezoelectric actuation system orelectrostatic actuation system. And if micro-electrical-mechanicalsystem (MEMS) actuator 24 is a hybrid in-plane/out-of-plane MEMSactuator, the combination in-plane/out-of-plane MEMS actuator mayinclude an electrostatic comb drive actuation system and a piezoelectricactuation system.

As will be discussed below in greater detail, examples of optoelectronicdevice 26 may include but are not limited to an image sensor, a holderassembly, a UV filter and/or a lens assembly. Examples of electroniccomponents 18 may include but are not limited to various electronic orsemiconductor components and devices. Flexible circuit 20 and/orconnector 22 may be configured to electrically couple MEMS package 10 toe.g., a smart phone or a digital camera (represented as generic item28).

As will be discussed below in greater detail,micro-electrical-mechanical system (MEMS) actuator 24 may be sized sothat it may fit within a recess in printed circuit board 12. The depthof this recess within printed circuit board 12 may vary depending uponthe particular embodiment and the physical size ofmicro-electrical-mechanical system (MEMS) actuator 24.

In some embodiments, some of the components of MEMS package 10 may bejoined together using various epoxies/adhesives. For example, an outerframe of micro-electrical-mechanical system (MEMS) actuator 24 mayinclude contact pads that may correspond to similar contact pads onprinted circuit board 12.

Referring also to FIG. 2A, there is shown multi-axis MEMS assembly 14,which may include optoelectronic device 26 coupled tomicro-electrical-mechanical system (MEMS) actuator 24. As discussedabove, examples of micro-electrical-mechanical system (MEMS) actuator 24may include but are not limited to an in-plane MEMS actuator, anout-of-plane MEMS actuator, and a combination in-plane/out-of-plane MEMSactuator.

When configured to provide in-plane actuation functionality,micro-electrical-mechanical system (MEMS) actuator 24 may include outerframe 30, plurality of electrically conductive flexures 32, MEMSactuation core 34 for attaching a payload (e.g., a device), and attachedoptoelectronic device 26. Optoelectronic device 26 may be coupled toMEMS actuation core 34 of micro-electrical-mechanical system (MEMS)actuator 24 by epoxy (or various other adhesives/materials and/orbonding methods).

Referring also to FIG. 2B, plurality of electrically conductive flexures32 of micro-electrical-mechanical system (MEMS) actuator 24 may becurved upward and buckled to achieve the desired level of flexibility.In the illustrated embodiment, plurality of electrically conductiveflexures 32 may have one end attached to MEMS actuation core 34 (e.g.,the moving portion of micro-electrical-mechanical system (MEMS) actuator24) and the other end attached to outer frame 30 (e.g., the fixedportion of micro-electrical-mechanical system (MEMS) actuator 24).

Plurality of electrically conductive flexures 32 may be conductive wiresthat may extend above the plane (e.g., an upper surface) ofmicro-electrical-mechanical system (MEMS) actuator 24 and mayelectrically couple laterally separated components ofmicro-electrical-mechanical system (MEMS) actuator 24. For example,plurality of electrically conductive flexures 32 may provide electricalsignals from optoelectronic device 26 and/or MEMS actuation core 34 toouter frame 30 of micro-electrical-mechanical system (MEMS) actuator 24.As discussed above, outer frame 30 of micro-electrical-mechanical system(MEMS) actuator 24 may be affixed to circuit board 12 using epoxy (orvarious other adhesive materials or devices).

Referring also to FIG. 3, there is shown a top view ofmicro-electrical-mechanical system (MEMS) actuator 24 in accordance withvarious embodiments of the disclosure. Outer frame 30 is shown toinclude (in this example) four frame assemblies (e.g., frame assembly100A, frame assembly 100B, frame assembly 100C, frame assembly 100D)that are shown as being spaced apart to allow for additional detail.

Outer frame 30 of micro-electrical-mechanical system (MEMS) actuator 24may include a plurality of contact pads (e.g., contact pads 102A onframe assembly 100A, contact pads 102B on frame assembly 100B, contactpads 102C on frame assembly 100C, and contact pads 102D on frameassembly 100D), which may be electrically coupled to one end ofplurality of electrically conductive flexures 32. The curved shape ofelectrically conductive flexures 32 is provided for illustrativepurposes only and, while illustrating one possible embodiment, otherconfigurations are possible and are considered to be within the scope ofthis disclosure.

MEMS actuation core 34 may include a plurality of contact pads (e.g.,contact pads 104A, contact pads 104B, contact pads 104C, contact pads104D), which may be electrically coupled to the other end of pluralityof electrically conductive flexures 32. A portion of the contact pads(e.g., contact pads 104A, contact pads 104B, contact pads 104C, contactpads 104D) of MEMS actuation core 34 may be electrically coupled tooptoelectronic device 26 by wire bonding, silver paste, or eutecticseal, thus allowing for the electrical coupling of optoelectronic device26 to outer frame 30.

MEMS actuation core 34 may include one or more comb drive sectors (e.g.,comb drive sector 106) that are actuation sectors disposed withinmicro-electrical-mechanical system (MEMS) actuator 24. The comb drivesectors (e.g., comb drive sector 106) within MEMS actuation core 34 maybe disposed in the same plane and may be positioned orthogonal to eachother to allow for movement in two axes (e.g., the X-axis and theY-axis). Accordingly, the in-plane MEMS actuator generally (and MEMSactuation core 34 specifically) may be configured to provide linearX-axis movement and linear Y-axis movement.

While in this particular example, MEMS actuation core 34 is shown toinclude four comb drive sectors, this is for illustrative purposes onlyand is not intended to be a limitation of this disclosure, as otherconfigurations are possible. For example, the number of comb drivesectors may be increased or decreased depending upon design criteria.

While in this particular example, the four comb drive sectors are shownto be generally square in shape, this is for illustrative purposes onlyand is not intended to be a limitation of this disclosure, as otherconfigurations are possible. For example, the shape of the comb drivesectors may be changed to meet various design criteria.

Each comb drive sector (e.g., comb drive sector 106) within MEMSactuation core 34 may include one or more moving portions and one ormore fixed portions. As will be discussed below in greater detail, acomb drive sector (e.g., comb drive sector 106) within MEMS actuationcore 34 may be coupled, via a cantilever assembly (e.g., cantileverassembly 108), to outer periphery 110 of MEMS actuation core 34 (i.e.,the portion of MEMS actuation core 34 that includes contact pads 104A,contact pads 104B, contact pads 104C, contact pads 104D), which is theportion of MEMS actuation core 34 to which optoelectronic device 26 maybe coupled, thus effectuating the transfer of movement to optoelectronicdevice 26.

Referring also to FIG. 4, there is shown a top view of comb drive sector106 in accordance with various embodiments of the present disclosure.Each comb drive sector (e.g., comb drive sector 106) may include one ormore motion control cantilever assemblies (e.g., motion controlcantilever assemblies 150A, 150B) positioned outside of comb drivesector 106, moveable frame 152, moveable spines 154, fixed frame 156,fixed spines 158, and cantilever assembly 108 that is configured tocouple moving frame 152 to outer periphery 110 of MEMS actuation core34. In this particular configuration, motion control cantileverassemblies 150A, 150B may be configured to prevent Y-axis displacementbetween moving frame 152/moveable spines 154 and fixed frame 156/fixedspines 158.

Comb drive sector 106 may include a movable member including moveableframe 152 and multiple moveable spines 154 that are generally orthogonalto moveable frame 152. Comb drive sector 106 may also include a fixedmember including fixed frame 156 and multiple fixed spines 158 that aregenerally orthogonal to fixed frame 156. Cantilever assembly 108 may bedeformable in one direction (e.g., in response to Y-axis deflectiveloads) and rigid in another direction (e.g., in response to X-axistension and compression loads), thus allowing for cantilever assembly108 to absorb motion in the Y-axis but transfer motion in the X-axis.

Referring also to FIG. 5, there is shown a detail view of portion 160 ofcomb drive sector 106. Moveable spines 154A, 154B may include aplurality of discrete moveable actuation fingers that are generallyorthogonally-attached to moveable spines 154A, 154B. For example,moveable spine 154A is shown to include moveable actuation fingers 162Aand moveable spine 154B is shown to include moveable actuation fingers162B.

Further, fixed spine 158 may include a plurality of discrete fixedactuation fingers that are generally orthogonally-attached to fixedspine 158. For example, fixed spine 158 is shown to include fixedactuation fingers 164A that are configured to mesh and interact withmoveable actuation fingers 162A. Further, fixed spine 158 is shown toinclude fixed actuation fingers 164B that are configured to mesh andinteract with moveable actuation fingers 162B.

Accordingly, various numbers of actuation fingers may be associated with(i.e. coupled to) the moveable spines (e.g., moveable spines 154A, 154B)and/or the fixed spines (e.g., fixed spine 158) of comb drive sector106. As discussed above, each comb drive sector (e.g., comb drive sector106) may include two motion control cantilever assemblies 150A, 150Bseparately placed on each side of comb drive sector 106. Each of the twomotion control cantilever assemblies 150A, 150B may be configured tocouple moveable frame 152 and fixed frame 156, as this configurationenables moveable actuation fingers 162A, 162B to be displaceable in theX-axis with respect to fixed actuation fingers 164A, 164B (respectively)while preventing moveable actuation fingers 162A, 162B from beingdisplaced in the Y-axis and contacting fixed actuation fingers 164A,164B (respectively).

While actuation fingers 162A, 162B, 164A, 164B (or at least the centeraxes of actuation fingers 162A, 162B, 164A, 164B) are shown to begenerally parallel to one another and generally orthogonal to therespective spines to which they are coupled, this is for illustrativepurposes only and is not intended to be a limitation of this disclosure,as other configurations are possible. Further and in some embodiments,actuation fingers 162A, 162B, 164A, 164B may have the same widththroughout their length and in other embodiments, actuation fingers162A, 162B, 164A, 164B may be tapered.

Further and in some embodiments, moveable frame 152 may be displaced inthe positive X-axis direction when a voltage potential is appliedbetween actuation fingers 162A and actuation fingers 164A, whilemoveable frame 152 may be displaced in the negative X-axis directionwhen a voltage potential is applied between actuation fingers 162B andactuation fingers 164B.

Referring also to FIG. 6, there is shown a detail view of portion 200 ofcomb drive sector 106. Fixed spine 158 may be generally parallel tomoveable spine 154B, wherein actuation fingers 164B and actuationfingers 162B may overlap within region 202, wherein the width of overlapregion 202 is typically in the range of 10-50 microns.

While overlap region 202 is described as being in the range of 10-50microns, this is for illustrative purposes only and is not intended tobe a limitation of this disclosure, as other configurations arepossible.

Overlap region 202 may represent the distance 204 where the ends ofactuation fingers 162B extends past and overlap the ends of actuationfingers 164B, which are interposed therebetween. In some embodiments,actuation fingers 162B and actuation fingers 164B may be tapered suchthat their respective tips are narrower than their respective bases(i.e., where they are attached to their spines). As is known in the art,various degrees of taper may be utilized with respect to actuationfingers 162B and actuation fingers 164B. Additionally, the overlap ofactuation fingers 162B and actuation fingers 164B provided by overlapregion 202 may help ensure that there is sufficient initial actuationforce when an electrical voltage potential is applied so that MEMSactuation core 34 may move gradually and smoothly without any suddenjumps with varying the applied voltage. The height of actuation fingers162B and actuation fingers 164B may be determined by various aspects ofthe MEMS fabrication process and various design criteria.

Length 206 of actuation fingers 162B and actuation fingers 164B, thesize of overlap region 202, the gaps between adjacent actuation fingers,and actuation finger taper angles that are incorporated into variousembodiments may be determined by various design criteria, applicationconsiderations, and manufacturability considerations, wherein thesemeasurements may be optimized to achieve the required displacementutilizing the available voltage potential.

As shown in FIG. 3 and as discussed above, MEMS actuation core 34 mayinclude one or more comb drive sectors (e.g., comb drive sector 106),wherein the comb drive sectors (e.g., comb drive sector 106) within MEMSactuation core 34 may be disposed in the same plane and may bepositioned orthogonal to each other to allow for movement in two axes(e.g., the X-axis and the Y-axis).

Specifically and in this particular example, MEMS actuation core 34 isshown to include four comb drive sectors (e.g., comb drive sectors 106,250, 252, 254). As discussed above, comb drive sector 106 is configuredto allow for movement along the X-axis, while preventing movement alongthe Y-axis. As comb drive sector 252 is similarly configured, comb drivesector 252 may allow for movement along the X-axis, while preventingmovement along the Y-axis. Accordingly, if a signal is applied to combdrive sector 106 that provides for positive X-axis movement, while asignal is applied to comb drive sector 252 that provides for negativeX-axis movement, actuation core 34 may be displaced in a clockwisedirection. Conversely, if a signal is applied to comb drive sector 106that provides for negative X-axis movement, while a signal is applied tocomb drive sector 252 that provides for positive X-axis movement,actuation core 34 may be displaced in a counterclockwise direction.

Further, comb drive sectors 250, 254 are configured (in this example) tobe orthogonal to comb drive sectors 106, 252. Accordingly, comb drivesectors 250, 254 may be configured to allow for movement along theY-axis, while preventing movement along the X-axis. Accordingly, if asignal is applied to comb drive sector 250 that provides for positiveY-axis movement, while a signal is applied to comb drive sector 254 thatprovides for negative Y-axis movement, actuation core 34 may bedisplaced in a counterclockwise direction. Conversely, if a signal isapplied to comb drive sector 250 that provides for negative Y-axismovement, while a signal is applied to comb drive sector 254 thatprovides for positive Y-axis movement, actuation core 34 may bedisplaced in a clockwise direction.

Accordingly, the in-plane MEMS actuator generally (and MEMS actuationcore 34 specifically) may be configured to provide rotational (e.g.,clockwise or counterclockwise) Z-axis movement

As stated above, examples of micro-electrical-mechanical system (MEMS)actuator 24 may include but are not limited to an in-plane MEMSactuator, an out-of-plane MEMS actuator, and a combinationin-plane/out-of-plane MEMS actuator. For example and in the embodimentshown in FIG. 1, micro-electrical-mechanical system (MEMS) actuator 24is shown to include an in-plane MEMS actuator (e.g., in-plane MEMSactuator 256) and an out-of-plane MEMS actuator (e.g., out-of-plane MEMSactuator 258), wherein FIGS. 3-6 illustrate one possible embodiment ofin-plane MEMS actuator 256. Optoelectronic device 26 may be coupled toin-plane MEMS actuator 256; and in-plane MEMS actuator 256 may becoupled to out-of-plane MEMS actuator 258.

An example of in-plane MEMS actuator 256 may include but is not limitedto an image stabilization actuator. As is known in the art, imagestabilization is a family of techniques that reduce blurring associatedwith the motion of a camera or other imaging device during exposure.Generally, it compensates for pan and tilt (angular movement, equivalentto yaw and pitch) of the imaging device, though electronic imagestabilization may also compensate for rotation. Image stabilization maybe used in image-stabilized binoculars, still and video cameras,astronomical telescopes, and smartphones. With still cameras, camerashake may be a particular problem at slow shutter speeds or with longfocal length (telephoto or zoom) lenses. With video cameras, camerashake may cause visible frame-to-frame jitter in the recorded video. Inastronomy, the problem may be amplified by variations in the atmosphere(which changes the apparent positions of objects over time).

An example of out-of-plane MEMS actuator 258 may include but is notlimited to an autofocus actuator. As is known in the art, an autofocussystem may use a sensor, a control system and an actuator to focus on anautomatically (or manually) selected area. Autofocus methodologies maybe distinguished by their type (e.g., active, passive or hybrid).Autofocus systems may rely on one or more sensors to determine correctfocus, wherein some autofocus systems may rely on a single sensor whileothers may use an array of sensors.

Referring also to FIGS. 7A-7C, there is shown one possible embodiment ofout-of-plane MEMS actuator 258 in various states ofactivation/excitation. Out-of-plane MEMS actuator 258 may include frame260 (which is configured to be stationary) and moveable stage 262,wherein out-of-plane MEMS actuator 258 may be configured to providelinear Z-axis movement. For example, out-of-plane MEMS actuator 258 mayinclude a multi-morph piezoelectric actuator that may be selectively andcontrollably deformable when an electrical charge is applied, whereinthe polarity of the applied electrical charge may vary the direction inwhich the multi-morph piezoelectric actuator (i.e., out-of-plane MEMSactuator 258) is deformed. For example, FIG. 7A shows out-of-plane MEMSactuator 258 in a natural position without an electrical charge beingapplied. Further, FIG. 7B shows out-of-plane MEMS actuator 258 in anextended position (i.e., displaced in the direction of arrow 264) withan electrical charge having a first polarity being applied, while FIG.7C shows out-of-plane MEMS actuator 258 in a retracted position (i.e.,displaced in the direction of arrow 266) with an electrical chargehaving an opposite polarity being applied.

As discussed above, the multi-morph piezoelectric actuator (i.e.,out-of-plane MEMS actuator 258) may be deformable by applying anelectrical charge. In order to accomplish such deformability that allowsfor such linear Z-axis movement, the multi-morph piezoelectric actuator(i.e., out-of-plane MEMS actuator 258) may include a bendingpiezoelectric actuator.

As discussed above, the multi-morph piezoelectric actuator (i.e.,out-of-plane MEMS actuator 258) may include rigid frame assembly 260(which is configured to be stationary) and moveable stage 262 that maybe configured to be affixed to in-plane MEMS actuator 256. As discussedabove, optoelectronic device 26 may be coupled to in-plane MEMS actuator256 and in-plane MEMS actuator 256 may be coupled to out-of-plane MEMSactuator 258. Accordingly and when out-of-plane MEMS actuator 258 is inan extended position (i.e., displaced in the direction of arrow 264)with an electrical charge having a first polarity being applied (asshown in FIG. 7B), optoelectronic device 26 may be displaced in thepositive z-axis direction and towards a lens assembly (e.g., lensassembly 300, FIG. 8). Alternatively and when out-of-plane MEMS actuator258 is in a retracted position (i.e., displaced in the direction ofarrow 266) with an electrical charge having an opposite polarity beingapplied (as shown in FIG. 7C), optoelectronic device 26 may be displacedin the negative z-axis direction and away from a lens assembly (e.g.,lens assembly 300, FIG. 8). Accordingly and by displacing optoelectronicdevice 26 in the z-axis with respect to a lens assembly (e.g., lensassembly 300, FIG. 8), autofocus functionality may be achieved.

The multi-morph piezoelectric actuator (i.e., out-of-plane MEMS actuator258) may include at least one deformable piezoelectric portion (e.g.,deformable piezoelectric portions 268, 270, 272, 274) configured tocouple moveable stage 262 to rigid frame assembly 260.

For example and in one particular embodiment, multi-morph piezoelectricactuator (i.e., out-of-plane MEMS actuator 258) may include a rigidintermediate stage (e.g., rigid intermediate stages 276, 278). A firstdeformable piezoelectric portion (e.g., deformable piezoelectricportions 268, 270) may be configured to couple rigid intermediate stage(e.g., rigid intermediate stages 276, 278) to moveable stage 262; and asecond deformable piezoelectric portion (e.g., deformable piezoelectricportions 272, 274) may be configured to couple the rigid intermediatestage (e.g., rigid intermediate stages 276, 278) to rigid frame assembly260.

Linear Z-axis (i.e., out-of-plane) movement of moveable stage 262 ofout-of-plane MEMS actuator 258 may be generated due to the deformationof the deformable piezoelectric portion (e.g., deformable piezoelectricportions 268, 270, 272, 274), which may be formed of a piezoelectricmaterial (e.g., PZT (lead zirconate titanate), zinc oxide or othersuitable material) that may be configured to deflect in response to anelectrical signal. As is known in the art, piezoelectric materials are aspecial type of ceramic that expands or contracts when an electricalcharge is field, thus generating motion and force.

While out-of-plane MEMS actuator 258 is described above as including asingle moveable stage (e.g., moveable stage 262) that enables linearmovement in the Z-axis, this is for illustrative purposes only and isnot intended to be a limitation of this disclosure, as otherconfigurations are possible and are considered to be within the scope ofthis disclosure. For example, out-of-plane MEMS actuator 258 may beconfigured to include multiple moveable stages. For example, if rigidintermediate stages 276, 278 were configured to be separatelycontrollable, additional degrees of freedom (such as tip and/or tilt)may be achievable. For example and in such a configuration, displacingintermediate stage 276 in an upward direction (i.e., in the direction ofarrow 264) while displacing intermediate stage 278 in a downwarddirection (i.e., in the direction of arrow 266) would result inclockwise rotation of optoelectronic device 26 about the Y-axis; whiledisplacing intermediate stage 276 in a downward direction (i.e., in thedirection of arrow 266) while displacing intermediate stage 278 in aupward direction (i.e., in the direction of arrow 264) would result incounterclockwise rotation of optoelectronic device 26 about the Y-axis.Additionally/alternatively, corresponding clockwise and counterclockwiseof optoelectronic device 26 about the X-axis may be achieved viaadditional/alternative intermediate stages.

Electromagnetic Actuation:

While in-plane MEMS actuator 256 is described above as being 100% MEMSbased, this is for illustrative purposes only and is not intended to bea limitation of this disclosure, as other configurations are possibleand are considered to be within the scope of this disclosure. Forexample and as will be discussed below, in-plane MEMS actuator 256 maybe an electromagnetic actuator portion.

Accordingly and referring also to FIGS. 9-10, in-plane MEMS actuator 256may be configured as a “hybrid” actuator in that it may include anelectromagnetic actuator portion (e.g., electromagnetic actuator portion300) in addition to a MEMS “hybrid” portion (e.g., MEMS portion 302).Electromagnetic actuator portion 300 may include at least one magneticassembly (e.g., magnetic assemblies 304, 306, 308, 310). The quantity ofmagnetic assemblies included within electromagnetic actuator portion 300may vary depending upon various design criteria. For example, thequantity of magnetic assemblies included within electromagnetic actuatorportion 300 may vary depending upon the number of axes in which linermovement is required of the actuator in question.

As in known in the art, the strength of a magnetic field (and,therefore, the strength of a magnetic force) generated may be varied bycontrolling the level of current applied to the magnetic assemblies(e.g., magnetic assemblies 304, 306, 308, 310). Accordingly and bycontrolling such current (e.g., the strength and/or the direction), theamount of linear movement (e.g., with respect to the X-axis and theY-axis) as well as the amount of rotation (e.g., with respect to theZ-axis) may be controlled. When configured as such a “hybrid” actuator,the MEMS portion (e.g., MEMS actuator portion 302) of the “hybrid”actuator may be configured to provide general structural stability &integrity (e.g., by providing the functionality of the variouscantilever assemblies, such as cantilever assembly 108) and theelectromagnetic field.

As discussed above, in-plane MEMS actuator 256 may be configured toprovide one or more of linear X-axis movement, linear Y-axis movementand rotational Z-axis movement. As discussed above, in order toeffectuate such movement via a purely MEMS-based actuator (e.g., asshown in FIG. 3), four MEMS-based motion stages (e.g., comb drivesectors 106, 250, 252, 254) may be utilized, wherein drive sectors 250,254 may be positioned orthogonal with respect to drive sectors 106, 252.

In order to effectuate such linear X-axis movement, linear Y-axismovement and rotational Z-axis movement, various magnetic assemblies maybe utilized. Accordingly, at least one magnetic assembly (e.g., one ormore of magnetic assemblies 304, 306, 308, 310) may be configured toenable in-plane displacement of optoelectronic device 26. For example,electromagnetic actuator portion 300 may include four magneticassemblies (e.g., magnetic assemblies 304, 306, 308, 310), whereinmagnetic assemblies 306, 310 (and their respective magnetic poles) maybe positioned orthogonal with respect to magnetic assemblies 304, 308(and their respective magnetic poles). Accordingly and by controllingthe current applied to the magnetic assemblies (e.g., one or more ofmagnetic assemblies 304, 306, 308, 310), the amount of linear movement(e.g., with respect to the X-axis and/or the Y-axis and/or the amount ofrotation with respect to the Z-axis) may be controlled, thus enablinglinear X-axis and/or Y-axis displacement (and rotational Z-axisdisplacement) of optoelectronic device 26.

MEMS portion 302 of in-plane MEMS actuator 256 may include a pluralityof motions stages (e.g., motion stages 312, 314, 316, 318) that areconfigured to interact with the plurality of magnetic assemblies (e.g.,magnetic assemblies 304, 306, 308, 310) included within electromagneticactuator portion 300.

Specifically and in the embodiment shown in FIGS. 9-10:

-   -   motion stage 312 may be configured to interact with magnetic        assembly 304;    -   motion stage 314 may be configured to interact with magnetic        assembly 306;    -   motion stage 316 may be configured to interact with magnetic        assembly 308; and    -   motion stage 318 may be configured to interact with magnetic        assembly 310.

Referring also to FIG. 11, there is shown a detail view of motion stage312 of MEMS portion 302 of in-plane MEMS actuator 256, although it isunderstood that this is merely for illustrative purpose and mayrepresent any motion stage.

MEMS portion 302 of in-plane MEMS actuator 256 may include: electricalflexures (e.g., electrically conductive flexures 32 of FIGS. 2A-2B);motion control flexures (e.g., motion control cantilever assemblies150A, 150B of FIG. 4); motion transfer flexures (e.g., cantileverassembly 108 of FIG. 4); deposited magnets with different polarizationsections (e.g., deposited magnetic structure 350); and deposited orplaced metallic layer (e.g., deposited metallic layer 352) positioned on(in this illustrative embodiment) deposited or placed magnetic structure350.

Polarized magnetic material/magnets (e.g., deposited magnetic structure350) may be deposited (or glued) upon each motion stage (e.g., motionstages 312, 314, 316, 318) of MEMS portion 302 of in-plane MEMS actuator256. A nickel/iron layer (e.g., deposited metallic layer 352) may bedeposited (or glued) upon deposited magnetic structure 350, wherein thedeposited magnetic structure (e.g., deposited magnetic structure 350)included in each of the motion stages (e.g., motion stage 312 in thisexample) may be arranged to have differing polarizations to effectuatethe above-described X-axis movement, Y-axis movement and/or Z-axisrotation.

Referring also to FIG. 12, there is shown a detail view ofelectromagnetic actuator portion 300, which (in this illustrativeembodiment) is shown to include four magnetic assemblies (e.g., magneticassemblies 304, 306, 308, 310). Electromagnetic actuator portion 300 mayinclude metallic plate assembly 400 to which the magnetic assemblies(e.g., magnetic assemblies 304, 306, 308, 310) are glued. The magneticassembly may be for example a winding coil or printed coil. The coilwinding wires (e.g., winding wires 402, 404, 406, 408) for the magneticassemblies (e.g., magnetic assemblies 304, 306, 308, 310 respectively)are electrically coupled to printed circuit board 12.

Electromagnetic Operation:

Referring also to FIG. 13, there is shown a cross-sectional view ofin-plane MEMS actuator 256, which includes electromagnetic actuatorportion 300 and MEMS portion 302. Electromagnetic actuator portion 300may include metallic plate assembly 400 and a plurality of magneticassemblies (e.g., of which magnetic assembly 304 is shown). MEMS portion302 may include deposited magnetic structure 350 and deposited metalliclayer 352.

During operation of in-plane MEMS actuator 256, the MEMS portion 302generate magnetic field by the magnetic structure 350. the currentprovided to the magnetic assemblies (e.g., magnetic assemblies 304, 306,308, 310) of electromagnetic actuator portion 300 may generate magneticfield 450 that may interact with the magnetic material/magnets (e.g.,deposited magnetic structure 350) within MEMS portion 302, resulting inthe above-described X-axis movement, Y-axis movement and/or Z-axisrotation of optoelectronic device 26 (due to magnetic assemblies 304,306, 308, 310 being rigidly affixed via metallic plate assembly 400.

Any heat generated by the magnetic assemblies (e.g., magnetic assemblies304, 306, 308, 310) may be conducted downward (e.g., to printed circuitboard 12 via metallic plate assembly 400, which may function as a heatsink).

General:

In general, the various operations of method described herein may beaccomplished using or may pertain to components or features of thevarious systems and/or apparatus with their respective components andsubcomponents, described herein.

The presence of broadening words and phrases such as “one or more,” “atleast,” “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent.

Additionally, the various embodiments set forth herein are described interms of example block diagrams, flow charts and other illustrations. Aswill become apparent to one of ordinary skill in the art after readingthis document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, block diagrams and their accompanying descriptionshould not be construed as mandating a particular architecture orconfiguration.

While various embodiments of the present disclosure have been describedabove, it should be understood that they have been presented by way ofexample only, and not of limitation. Likewise, the various diagrams maydepict an example architectural or other configuration for thedisclosure, which is done to aid in understanding the features andfunctionality that can be included in the disclosure. The disclosure isnot restricted to the illustrated example architectures orconfigurations, but the desired features can be implemented using avariety of alternative architectures and configurations. Indeed, it willbe apparent to one of skill in the art how alternative functional,logical or physical partitioning and configurations can be implementedto implement the desired features of the present disclosure.Additionally, with regard to flow diagrams, operational descriptions andmethod claims, the order in which the steps are presented herein shallnot mandate that various embodiments be implemented to perform therecited functionality in the same order unless the context dictatesotherwise.

Although the disclosure is described above in terms of various exampleembodiments and implementations, it should be understood that thevarious features, aspects and functionality described in one or more ofthe individual embodiments are not limited in their applicability to theparticular embodiment with which they are described, but instead can beapplied, alone or in various combinations, to one or more of the otherembodiments of the disclosure, whether or not such embodiments aredescribed and whether or not such features are presented as being a partof a described embodiment. Thus, the breadth and scope of the presentdisclosure should not be limited by any of the above-described exampleembodiments, and it will be understood by those skilled in the art thatvarious changes and modifications to the previous descriptions may bemade within the scope of the claims.

As will be appreciated by one skilled in the art, the present disclosuremay be embodied as a method, a system, or a computer program product.Accordingly, the present disclosure may take the form of an entirelyhardware embodiment, an entirely software embodiment (includingfirmware, resident software, micro-code, etc.) or an embodimentcombining software and hardware aspects that may all generally bereferred to herein as a “circuit,” “module” or “system.” Furthermore,the present disclosure may take the form of a computer program producton a computer-usable storage medium having computer-usable program codeembodied in the medium.

Any suitable computer usable or computer readable medium may beutilized. The computer-usable or computer-readable medium may be, forexample but not limited to, an electronic, magnetic, optical,electromagnetic, infrared, or semiconductor system, apparatus, device,or propagation medium. More specific examples (a non-exhaustive list) ofthe computer-readable medium may include the following: an electricalconnection having one or more wires, a portable computer diskette, ahard disk, a random access memory (RAM), a read-only memory (ROM), anerasable programmable read-only memory (EPROM or Flash memory), anoptical fiber, a portable compact disc read-only memory (CD-ROM), anoptical storage device, a transmission media such as those supportingthe Internet or an intranet, or a magnetic storage device. Thecomputer-usable or computer-readable medium may also be paper or anothersuitable medium upon which the program is printed, as the program can beelectronically captured, via, for instance, optical scanning of thepaper or other medium, then compiled, interpreted, or otherwiseprocessed in a suitable manner, if necessary, and then stored in acomputer memory. In the context of this document, a computer-usable orcomputer-readable medium may be any medium that can contain, store,communicate, propagate, or transport the program for use by or inconnection with the instruction execution system, apparatus, or device.The computer-usable medium may include a propagated data signal with thecomputer-usable program code embodied therewith, either in baseband oras part of a carrier wave. The computer usable program code may betransmitted using any appropriate medium, including but not limited tothe Internet, wireline, optical fiber cable, RF, etc.

Computer program code for carrying out operations of the presentdisclosure may be written in an object oriented programming languagesuch as Java, Smalltalk, C++ or the like. However, the computer programcode for carrying out operations of the present disclosure may also bewritten in conventional procedural programming languages, such as the“C” programming language or similar programming languages. The programcode may execute entirely on the user's computer, partly on the user'scomputer, as a stand-alone software package, partly on the user'scomputer and partly on a remote computer or entirely on the remotecomputer or server. In the latter scenario, the remote computer may beconnected to the user's computer through a local area network/a widearea network/the Internet (e.g., network 18).

The present disclosure is described with reference to flowchartillustrations and/or block diagrams of methods, apparatus (systems) andcomputer program products according to embodiments of the disclosure. Itwill be understood that each block of the flowchart illustrations and/orblock diagrams, and combinations of blocks in the flowchartillustrations and/or block diagrams, may be implemented by computerprogram instructions. These computer program instructions may beprovided to a processor of a general purpose computer/special purposecomputer/other programmable data processing apparatus, such that theinstructions, which execute via the processor of the computer or otherprogrammable data processing apparatus, create means for implementingthe functions/acts specified in the flowchart and/or block diagram blockor blocks.

These computer program instructions may also be stored in acomputer-readable memory that may direct a computer or otherprogrammable data processing apparatus to function in a particularmanner, such that the instructions stored in the computer-readablememory produce an article of manufacture including instruction meanswhich implement the function/act specified in the flowchart and/or blockdiagram block or blocks.

The computer program instructions may also be loaded onto a computer orother programmable data processing apparatus to cause a series ofoperational steps to be performed on the computer or other programmableapparatus to produce a computer implemented process such that theinstructions which execute on the computer or other programmableapparatus provide steps for implementing the functions/acts specified inthe flowchart and/or block diagram block or blocks.

The flowcharts and block diagrams in the figures may illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods and computer program products according to variousembodiments of the present disclosure. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof code, which comprises one or more executable instructions forimplementing the specified logical function(s). It should also be notedthat, in some alternative implementations, the functions noted in theblock may occur out of the order noted in the figures. For example, twoblocks shown in succession may, in fact, be executed substantiallyconcurrently, or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved. It will also be notedthat each block of the block diagrams and/or flowchart illustrations,and combinations of blocks in the block diagrams and/or flowchartillustrations, may be implemented by special purpose hardware-basedsystems that perform the specified functions or acts, or combinations ofspecial purpose hardware and computer instructions.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present disclosure has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the disclosure in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the disclosure. Theembodiment was chosen and described in order to best explain theprinciples of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

A number of implementations have been described. Having thus describedthe disclosure of the present application in detail and by reference toembodiments thereof, it will be apparent that modifications andvariations are possible without departing from the scope of thedisclosure defined in the appended claims.

What is claimed is:
 1. A multi-axis MEMS assembly comprising: amicro-electrical-mechanical system (MEMS) actuator configured to providelinear three-axis movement, the micro-electrical-mechanical system(MEMS) actuator including: an in-plane MEMS actuator, and anout-of-plane MEMS actuator; and an optoelectronic device coupled to themicro-electrical-mechanical system (MEMS) actuator; wherein the in-planeMEMS actuator includes an electromagnetic actuator portion.
 2. Themulti-axis MEMS assembly of claim 1 wherein the optoelectronic device iscoupled to one or more of: the in-plane MEMS actuator; and theout-of-plane MEMS actuator.
 3. The multi-axis MEMS assembly of claim 1wherein the in-plane MEMS actuator is an image stabilization actuator.4. The multi-axis MEMS assembly of claim 1 wherein the in-plane MEMSactuator is configured to provide linear X-axis movement and linearY-axis movement.
 5. The multi-axis MEMS assembly of claim 4 wherein thein-plane MEMS actuator is further configured to provide rotationalZ-axis movement.
 6. The multi-axis MEMS assembly of claim 1 wherein theout-of-plane MEMS actuator is an autofocus actuator.
 7. The multi-axisMEMS assembly of claim 1 wherein the out-of-plane MEMS actuator isconfigured to provide linear Z-axis movement.
 8. The multi-axis MEMSassembly of claim 1 wherein the electromagnetic actuator portionincludes: at least one magnetic assembly.
 9. The multi-axis MEMSassembly of claim 8 wherein the at least one magnetic assembly isconfigured to enable in-plane displacement of the optoelectronic device.10. The multi-axis MEMS assembly of claim 9 wherein the at least onemagnetic assembly includes a plurality of magnetic assemblies.
 11. Themulti-axis MEMS assembly of claim 10 wherein the plurality of magneticassemblies are configured to enable X-axis and/or Y-axis displacement ofthe optoelectronic device.
 12. A multi-axis MEMS assembly comprising: amicro-electrical-mechanical system (MEMS) actuator configured to providelinear three-axis movement, the micro-electrical-mechanical system(MEMS) actuator including: an in-plane MEMS actuator including anelectromagnetic actuator portion, and an out-of-plane MEMS actuator; andan optoelectronic device coupled to the micro-electrical-mechanicalsystem (MEMS) actuator.
 13. The multi-axis MEMS assembly of claim 12wherein the electromagnetic actuator portion includes: at least onemagnetic assembly configured to enable in-plane displacement of theoptoelectronic device.
 14. The multi-axis MEMS assembly of claim 13wherein the at least one magnetic assembly includes a plurality ofmagnetic assemblies.
 15. The multi-axis MEMS assembly of claim 14wherein the plurality of magnetic assemblies are configured to enableX-axis and/or Y-axis displacement of the optoelectronic device.
 16. Amulti-axis MEMS assembly comprising: a micro-electrical-mechanicalsystem (MEMS) actuator configured to provide linear multi-axis movement,the micro-electrical-mechanical system (MEMS) actuator including: anin-plane MEMS actuator including an electromagnetic actuator portion;and an optoelectronic device coupled to the micro-electrical-mechanicalsystem (MEMS) actuator.
 17. The multi-axis MEMS assembly of claim 16wherein the electromagnetic actuator portion includes: at least onemagnetic assembly configured to enable in-plane displacement of theoptoelectronic device.
 18. The multi-axis MEMS assembly of claim 17wherein the at least one magnetic assembly includes a plurality ofmagnetic assemblies.
 19. The multi-axis MEMS assembly of claim 18wherein the plurality of magnetic assemblies are configured to enableX-axis and/or Y-axis displacement of the optoelectronic device.
 20. Themulti-axis MEMS assembly of claim 19 wherein the plurality of magneticassemblies are further configured to provide rotational Z-axis movement.